In the booming era of 5G technology, Artificial Intelligence (AI), and data centers, the architecture of printed circuit boards (PCBs) is becoming increasingly complex. Repairing and replacing high-end components on server mainboards, telecommunications equipment, or heavy industrial motherboards has always been a tough puzzle for hardware engineers. To thoroughly solve this challenge, Maxlab proudly introduces the ZM-R9100 Seamark Automatic BGA Chip Rework Station – a premium rework system featuring a super large heating area and fully automated operations.

Motherboards used in servers or telecommunications stations are usually very large, thick (multi-layered), and densely packed with micro-components. When using manual hot-air tools or conventional BGA repair machines, technicians frequently encounter severe risks:

The ZM-R9100 Seamark Automatic BGA Chip Rework Station was born as a total lifesaver, completely eliminating these risks by integrating the planet’s most advanced precision mechanics and closed-loop temperature control technologies.

The ZM-R9100 model boasts a massive workstation and a bottom infrared (IR) preheating zone measuring up to 695 × 590 mm. This allows it to easily secure and process circuit boards with maximum dimensions of 750 × 560 mm. The system utilizes 4 independent heating zones controlled by a closed-loop system to distribute thermal energy perfectly. As a result, the entire motherboard is preheated evenly, completely neutralizing the thermal stress that causes warping.

This is a revolutionary step forward by Seamark ZM. Instead of using solder wicks and physical soldering irons that rub against the delicate surface, the ZM-R9100 employs a vacuum suction nozzle combined with a high-sensitivity load cell and air pressure height-sensing technology. The machine automatically tracks the path and sucks away excess solder on the pads without ever touching the board. This technology provides absolute protection for sensitive pads and significantly extends the lifespan of expensive PCBs.

The chip placement accuracy of this machine reaches an astonishing ±0.025 mm. This incredible precision is achieved through the combination of a 5-Megapixel top camera, a 12-Megapixel bottom camera, and an exclusive image processing algorithm. The machine can smoothly handle components ranging from tiny 1 × 1 mm chips up to giant graphics processors and server CPUs measuring 120 × 120 mm.

Technicians only need to set up the thermal profile once and press a single button. The ZM-R9100 Seamark Automatic BGA Chip Rework Station will automatically execute a closed-loop sequence of 5 stages: Desoldering the broken chip \(\rightarrow \) Cleaning excess solder via non-contact detinning \(\rightarrow \) Automatic flux/solder paste dipping \(\rightarrow \) Optical alignment \(\rightarrow \) Soldering the new chip. This automated process helps businesses maximize productivity, eliminate human error, and guarantee consistent factory-grade repair quality.

As a high-end equipment weighing up to 1300 kg and integrating MES (Manufacturing Execution System) software connectivity, the ZM-R9100 requires a supplier with deep technical expertise to handle technology transfer.

Maxlab is proud to be the trusted partner accompanying EMS factories and major hardware repair centers in Vietnam. We commit to providing genuine ZM-R9100 Seamark Automatic BGA Chip Rework Station equipment, complete with professional installation, calibration, and customized thermal profile configuration tailored to your specific motherboards.