XRF

Investing in and implementing dedicated plating thickness XRF measurement systems (such as the iEDX series) plays a vital role in quality control and cost optimization for electronics, PCB, semiconductor, and metal finishing facilities. Utilizing advanced X-ray fluorescence technology, this XRF equipment enables completely non-destructive testing, precisely determining the thickness of multi-layered ultra-thin coatings up to 5 layers (such as Gold, Nickel, Copper, Tin, and Chromium) with nanometer-level accuracy. Equipping a laboratory or production line with a professional coating analysis XRF system allows enterprises to completely prevent peeling and corrosion defects caused by under-plating, while strictly monitoring precious metal consumption to eliminate waste. This serves as a strategic tool for manufacturers to flawlessly satisfy the stringent technical specifications of the high-end semiconductor and automotive industries, strengthening competitive edge and cementing their position in the global supply chain.