The XCT8500 universal industrial X-ray inspection system consists of a X-ray source,  detector,  scanning system, image reconstruction and analysis system. It can achieve inspection methods such as 2D/3D/CT, and is suitable for quality inspection, 3D measurement, and non-destructive analysis. Characterizing the micro-scale features of the internal structure of the sample, combined with qualitative and quantitative analysis software to achieve multi-angle measurement and analysis of the sample, as well as automatic determination of OK/NG conditions, and to provide effective data for product quality inspection.

It can be used for electronic component soldering quality inspection, BGA component, integrated circuit (IC) and its binding line inspection,  semiconductor packaging inspection and internal connection, electronic power (IGBT) module  inspection, and Wafer defect inspection (WLCSP).Including missing parts,  deviation, tin connection,contamination, faulty soldering, component foot warping, voids, pillow effect, and other soldering abnormalities.